Searching...
No suggestions found
Unable to load suggestions
These conference prodeedings cover such topics as: copper interconnects; novel devices; high-K dielectrics; process technology; embedded DRAM; gate el ... ectrode engineering; DRAM cells; gate oxide scaling and reliability; DRAM capacitors; and high performance RF.
You need to be logged in to recommend this book to others.
Loading book activity...
You need to be logged in to share your thoughts about this book.
You need to be logged in as an author to claim this book.
You need to be logged in to report a problem with this book.
You need to be logged in to edit your review.
This will sign you out of your BooksAffair account.